TEMPTRONIC CORPORATION
www.temptronic.com
sales@temptronic.com 

 


 

ThermoStream Systems

¹ÝµµÃ¼ IC, Module, PCBÀÇ ¿Âµµº¯È­¿¡ µû¸¥ Ư¼º ºÐ¼® À» À§ÇÑ     solution Á¦°ø
Hot & Cold air¸¦ test device³ª module À§¿¡ Á÷Á¢ ºÐ»çÇÏ¿© ºü¸¥     ¿Âµµ º¯È­¸¦ Çü¼º
ESD free designÀ¸·Î Á¤Àü±âdamageÀÇ °¡´É¼ºÀ» ÇØ°á
Á¤±³ÇÑ Closed Loop Á¦¾î ¹æ½ÄÀ» äÅÃÇÏ¿© ¾ÈÁ¤ÀûÀÎ ¿ÂµµÀÇ     À¯Áö¿Í 0.1'C resolution ±¸Çö
°øÅë option »ç¾çÀ¸·Î CTTE (Custom Thermal Test Enclosure)´Â     ´Ù¾çÇÑ sizeÀÇ board¿¡ ´ëÇÑ uniformÇÑ ¿Âµµ¸¦ °ø±ÞÇϸç, ¿øÇÏ´Â     ¸ð¾ç°ú Å©±â·Î ÁÖ¹® Á¦ÀÛ °¡´É 


 

 

 

 


 

TP04010A

Model

Temperature Range

TP04000 Series

 :-75¡É to +225¡É

TP04010 Series

 :-75¡É to +225¡É   

TP04100 Series  

 :-20¡É to +225¡É     

TP41 Series

TP41A: +30¡É to +150¡É
TP41B: +100¡É to +200¡É
TP41A: +160¡É to +300¡É

TP04100A

ThermoChuck Systems

Wafer size : 3,4,5,6,8,12inch
Wafer, IC, Hybrids ¶Ç´Â ´Ù¸¥ Á¾·ù deviceÀÇ ¿Âµµº¯È­¿¡ µû¸¥     Àü±âÀû Ư¼ºÀÇ ºÐ¼®¿¡ È®½ÇÇÑ solution Á¦°ø
¶Ù¾î³­ ¿Âµµ ¾ÈÁ¤¼º°ú ½Å¼ÓÇÑ heating/coolingÀº device test¿¡ ´ëÇÑ     Æí¸®ÇÔ°ú ½Å·Ú¼ºÀ» Á¦°ø
Low noise, low capacitance, low current ÃøÁ¤¿¡ À־ Ÿ¾÷ü¿Í´Â     ºñ±³ÇÒ ¼ö ¾ø´Â ±â¼ú°ú ¿¬±¸¸¦ ¹ÙÅÁÀ¸·Î ´Ù¾çÇÑ ¿ä±¸¿¡ ÀûÇÕÇÑ     ÀåºñÀÇ ±¸¼ºÀÌ °¡´É
 


TP03000 

Model

Temperature Range

TP03000 Series

:-65¡É to +130¡É (Standard)

 

:-65¡É to +200¡É (Extended)

TP03010A Series

: 20¡É to +130¡É (Standard)

 

  20¡É to +200¡É (Extended) 

TP03010B Series

: 0¡É to +130¡É (Standard) 

 

  0¡É to +200¡É (Extended)  

TP03020 Series

: 20¡É to +200¡É

TP03600A Series

: 20¡É to +300¡É

TP03600C Series

: 0¡É to +300¡É

TP0315A Series

: 30¡É to +200¡É (Standard)

 

  30¡É to +300¡É (Extended)

TP0315B Series

: 0¡É to +300¡É

 

 

ThermoMap Systems

Leakage Current¿¡ ÀÇÇÏ¿© ¹ß»ýÇÏ´Â Hot SpotÀ» °ËÃâ
Thermo imaging system for full color mapping of the temperature     distribution of a device
 1 micron spatial and 0.1¡É thermal resolution; for use in design,     analysis and hot spot location
Remote control of Hot Chuck System by Software


Thermo Map System

 

 

ThermoFixture Systems

For testing hybrids, MCMs, modules, PCBs and other devices in
   a custom enclosure with fixturing for integration with
ATE test    systems.


ThermoFixture

 

 

ThermoZone Systems

For testing, in-circuit probing and troubleshooting components     arrays, burn-in boards, printed circuit boards and small electronic     and electromechanical subassemblies.


ThermoZone

 

 

ThermoSpot Systems 

For testing and fault isolation of individual components at precise     hot and cold temperature at the tester socket or on a printed circuit     board.



 ThermoSpot

 

 

ThermoSocket Systems

For testing and locating micron size defects on chips even at 30     microwatt power levels. 


ThermoSocket


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