Package & Wafer Level EM (Electro Migration) test System
Package & Wafer Level Hot-Carrier test system
Package & Wafer Level TDDB test system
주요 특징 : 반도체 제품의 신뢰도 Test 인 EM, Hot-Carrier, TDDB test 장비를 공급하며, Al, Cu
등의 재질에 대한 신뢰도를 측정할 수 있다.
EM (ElectroMigration) system
240 packages per system upto 1Amp, 50Volt -50'C to 350'C oven available TCR extraction, Contact Electromigration test standard Package & Wafer level optional
EM system
Hot Carrier
upto 360 TRs per system upto 20V/1mV, 100mA/1pA resolution -50'C to 350'C oven available Leff, Weff, Mobility extraction available Package & Wafer level optional
TDDB
upto 1080 caps per system upto 36V/1mV, 10mA/1pA resolution -50'C to 350'C oven available Leff, Weff, Mobility extraction available Package & Wafer level optional Constant Voltage or Constant Current, Ramp Voltage or Ramp
Current biasing available
240 packages per system 
EM system