Manual
R/F Microwave probing system (RF1)
ISS, Contact Substrate,
Wafer¸¦ µ¿½Ã¿¡ ¼³Ä¡ÇÒ ¼ö ÀÖ´Â µ¶Æ¯ÇÑ Square Chuck designÀ¸·Î
110GHz Microwave Test ÇÒ ¼ö ÀÖ´Â Àú·ÅÇÑ Probing
System ÀÔ´Ï´Ù. .
<FEATURES>
- Compact
benchtop design
- Precision
150mm (6 in.) x-y stage
- 1
in. adjustable z-chuck height
- 150
mm (6 in.) microwave chuck
- Patented
auxiliary chucks for calibration substrates
- Switch-selectable
vacuum zones
- 1
in. coaxial x-y microscope transport
with safety lock
- Tilt-back
high power microscope option with compound
lift
- High
rigidity microwave platen, with precision
linear lift
- Accommodates
up to 4 microwave positioners
- Microwave
thermal chuck option (includes auxiliary
chucks)
<Application>
- Accurate
S-parameter device measurements
- Package
and interconnect probing
- Hybrid
probing, thermal analysis
- Electro-optic
device probing
- Design
engineering
- Production
test, reliability testing
- Incoming
inspection
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