Manual R/F Microwave probing system (RF1)

ISS, Contact Substrate, Wafer¸¦ µ¿½Ã¿¡ ¼³Ä¡ÇÒ ¼ö ÀÖ´Â µ¶Æ¯ÇÑ Square Chuck designÀ¸·Î 110GHz
Microwave Test ÇÒ ¼ö ÀÖ´Â Àú·ÅÇÑ Probing System ÀÔ´Ï´Ù. .

<FEATURES>

  • Compact benchtop design 
  • Precision 150mm (6 in.) x-y stage
  • 1 in. adjustable z-chuck height
  • 150 mm (6 in.) microwave chuck 
  • Patented auxiliary chucks for calibration substrates 
  • Switch-selectable vacuum zones
  • 1 in. coaxial x-y microscope transport with safety lock
  • Tilt-back high power microscope option with compound lift 
  • High rigidity microwave platen, with precision linear lift
  • Accommodates up to 4 microwave positioners 
  • Microwave thermal chuck option (includes auxiliary chucks)

<Application>

  • Accurate S-parameter device measurements
  • Package and interconnect probing
  • Hybrid probing, thermal analysis
  • Electro-optic device probing
  • Design engineering
  • Production test, reliability testing
  • Incoming inspection
 
 
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