Semiautomatic R/F Microwave,
DC/CV Parametric probing system
(Summit 12000 series)
 

Computer·ÎcontrolÇÏ¿© Ultra-Low Leakage Current¿Í Low Temperature environment¸¦ Á¦°øÀ¸·Î, Microwave Test, DC parametric test, Failure Analysis, Reliability test µî¿¡ »ç¿ëÇÒ ¼ö ÀÖ½À´Ï´Ù.

 

<FEATURES>

Wafer Size : 3" to 8" of Silicon, GaAs, etc.
Travel Resolution : less than 0.1um
Frequency Range : upto 110GHz
Chuck leakage plus noise : less than 20fA at non-thermal by patented FemtoGuarded Chuck
Thermal chuck Temperature : -55'C to +200'C by patented MicroChamber
Software : Windows 95, PCS control software, Wafer Mapping Control, GP-IB, RS-232C

<Application>

General electrical DC parametric test
 fA level low current measurement
Low temperature Measurement
C-V measurement
Hot Carrier Testing
Hfe-Gummel Testing
Triangular Voltage Sweep
Gate charge pumping   

<Optional>

Laser Cutting System
Thermal Chuck System
Auto-focus Microscope
Integrated Dark Box and Vibration Isolation Table

Other model: Summit 11000 series

 

 
 
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